当前“
无刷直流(BLDC)电机驱动芯片
”共 188件相关商品品牌
- ADI(亚德诺)
- ADI(亚德诺)/MAXIM(美信)
- Advanced Analog Technology(类比)
- ALLEGRO(美国埃戈罗)
- ANPEC(茂达电子)
- CJ(江苏长电/长晶)
- CRMICRO(华润微)
- CrossChip(成都芯进)
- DIODES(美台)
- EG(屹晶微)
- EM Microelectronic
- Fortior Tech(峰岹)
- HTCSEMI(海天芯)
- Infineon(英飞凌)
- JRC
- JSMSEMI(杰盛微)
- LEADPOWER(率能)
- LINKOSEMI(凌鸥创芯)
- LSI/CSI
- Megain(美佳音)
- Melexis(比利时迈来芯)
- MICROCHIP(美国微芯)
- MPS(芯源)
- MSKSEMI(美森科)
- Nisshinbo
- NUVOTON(新唐)
- NXP(恩智浦)
- onsemi(安森美)
- PANASONIC(松下)
- Power Integrations(帕沃英蒂格盛)
- PROLIFIC(旺玖)
- PTC(普诚)
- Qorvo
- RENESAS(瑞萨)/IDT
- ROHM(罗姆)
- SANKEN(三垦)
- SANYO DENKI(山洋)
- SGKS(森国科)
- SILAN(士兰微)
- ST(意法半导体) 已显示前 40 项，共 51 项，请输入关键词搜索
封装/规格
- -
- BGA-24
- BGA-325
- BSOP-28-300mil
- DFN-10
- DFN-10(2x3)
- DFN-10(3x3)
- DFN-6(1.5x2)
- DFN-6(2x2)
- DFN-8(2x2.5)
- DFN-8(2x3)
- DFN-8(3x3)
- DFN-8(4x4)
- DIL-8
- DIP-10
- DIP-16
- DIP-18
- DIP-20
- DIP-22
- DIP-23
- DIP-24
- DIP-26
- DIP-27
- DIP-28
- DIP-29
- DIP-30
- DIP-38
- DIP-40
- DIP-8
- DMP-16
- HSOP-28
- HSOP-28-300mil
- HSOP-28-EP-7.9mm
- HSOP-28-H
- HSOP-28-HC
- HSOP-36-8.8mm
- HSOP-7
- HSSOP-34-8.4mm
- HSSOP-36-11.0mm
- HSSOP-48-EP-7.9mm 已显示前 40 项，共 239 项，请输入关键词搜索
接口类型
- -
- I2C
- SPI
集成FET
- -
- 否
- 是
输出电流
- -
- 500mA
- 600mA
导通电阻
- -
- 80mΩ
- 95mΩ
- 250mΩ
- 1.5Ω
工作电压
- -
- 2.1V~5.5V
- 2.4V~14V
- 4.4V~45V
- 4.5V~45V
- 4.5V~35V
- 4.5V~60V
- 6V~95V
- 6.2V~28V
- 8V~52V
峰值电流
- -
- 50mA
- 1A
- 2A
- 3A
- 13A
- 15A
工作温度
- -55℃~+125℃
- -40℃~+125℃@(Ta)
- -40℃~+85℃
- -40℃~+125℃
- -40℃~+150℃
包装/方式
- 托盘
- 盒装
- 管装
- 编带
- 袋装
筛选结果：
188
